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IPC-III Standard PCB Circuit Board Assembly Smart Watch 0.076mm Buried Cpacitor

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Global Well Electronic Co., LTD

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Brand Name : OEM/ODM

Model Number : GW-0258

Certification : ISO/TS16949/RoHS/TS16949

Place of Origin : Guangdong, China

MOQ : 1PCS

Price : USD+0.1-6+per pcs

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000 Square Meter/Square Meters per Month module electronic board

Delivery Time : PCB 3-7dyas, PCBA 1-3weeks/1 - 1000 -15days；1001 - 5000-20days；5001 - 20000-35days

Packaging Details : Vacumn packing for bare board, standand cartons outside for shipping

Type : smart electronics pcba

Supplier Type : Factory/Manufacturer

Certificate : ISO/TS16949/RoHS/TS16949

Layer : 1-40 Layer

Solder mask : Green Black Bule White

Silkscreen Color : White Black

PCB Standard : IPC-A-610 D/IPC-III Standard

Hole tolerance : PTH: ±2mil, NTPH: ±2mil

Board Thickness Tolerance : ±10%

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Product Description

Electronic Pcba Manufacturer Smart Watch Pcb Circuit Board Assembly

Technology Capabilities
Layer	1~22L
Min.inner Layer Trace	0.076mm
Min.inner layer Space	0.076mm
Min.outer Layer Trace	0.076mm
Min.outer Layer Trace	0.076mm
Max.inner layer copper Thickness	6oz
Max.outer layer copper Thickness	14oz
Layer to Layer registration tolerance <10L	+/-0.076mm
Layer to Layer registration tolerance >10L	+/-0.125mm
Max.Finished board thickness	8mm
Min.Finished board thickness	0.3mm
Min.Core Dielectric thickness	0.051mm
Min.Impedance-Differential	+/-5%
HDI Stack up	1+N+1,2+N+2,3+N+3
Controlled Depth Drilling Tolerance	+/-0.1mm
Advanced	Buried cpacitor,buried Resistor,Embedded coin,rigid -flex,Rigid- Flex+HDI,Rigid-flex+Metal Base
Max Production Panel Size	24.5"*43"
Via in PAD	YES
BGA Pitch(with trace)	0.4mm
Soldermask Registration	+/-0.03mm
Min.Solder Dam	0.064mm
Min.Drilled Hole size-Mechanical	0.2mm
Min.Drilled Hole size-Laser	0.1mm
Max.Laser Drill Aspect Ratio	20:01
Press Fit Hole	+/-0.05mm
Layer To layer Registration Tolerance	0.04mm
Min.Dielectric Thickness	0.04mm
Controlled Depth Drilling	YES
BGA Pitch(with trace)	0.5mm
surface Finishing	ENIG,OSP,Immersion tin,immersion silver,HASL,Electrolytic gold,
Materil	Normal TG,Middle Tg,High Tg,Halogen free,Low Dk Laminate, High Frequency Laminate,PI Laminate,BT Laminate

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IPC-III PCB Circuit Board Assembly

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